SIGNAL AND POWER INTEGRITY OF HIGH-SPEED PRINTED CIRCUIT BOARDS

Docente responsabile

FLAVIA GRASSI

CCS proponenti

Ingegneria Elettrica

CFU

2

Ore in presenza

20

Prerequisiti

Basic knowledge of circuit theory, electromagnetic compatibility, EM fields.

N° max studenti

100

Parole chiave:

Signal and Power Integrity, electromagnetic compatibility

Tag

Engineering, Information technologies

Descrizione dell'iniziativa

Design and analysis of interconnects in high-speed electronic systems; understanding of high-speed signal propagation and signal and power integrity concepts; electromagnetic simulation tools and experimental techniques.

• Introduction of signal and power integrity issues for the design of high-speed interconnects. Activity: lectures.
• Keysight Technologies: Presentation of electromagnetic and signal integrity simulation with Keysight EDA tools. Interactive sessions aimed at guiding the students through the solution of canonical problems via circuit and electromagnetic solvers. Activity: simulation.
• SECO Embedded Creators: Presentation of design issues of a computer on a board; experimental demonstration with debugging of signal integrity failures in a practical use case (udoo project). Activity: measurement and simulation. Ansys: Presentation of electromagnetic and signal integrity simulation with HFSS e Slwave tools. Interactive sessions aimed at guiding the students through the solution of canonical problems via circuit and electromagnetic solvers. Main activity: Numerical simulations
• STMicroelectronics: Presentation of design issues of packages; introduction of electromagnetic simulation as a tool to optimize package design; Simulation of real test cases.
  

Periodo di svolgimento

dal May 2025 a June 2025

Calendario

21 Maggio - 8:15-11:15
22 Maggio - 8:15-11:15 & 12:30-15:30
23 Maggio - 8:15-10:15
28 Maggio - 8:15-11:15
29 Maggio - 8:15-11:15 & 12:30-15:30